Power Driver Modules - Electronic Components Distributor - page 14

Manufacturers

CUI Inc.

Vishay General Semiconductor - Diodes Division

Tamura

Microchip Technology

TE Connectivity Corcom Filters

Analog Devices Inc./Maxim Integrated

Omron Automation and Safety

IXYS

Toshiba Semiconductor and Storage

Phoenix Contact

Microsemi Corporation

Infineon Technologies

Alpha & Omega Semiconductor Inc.

Thomas Research Products

GeneSiC Semiconductor

Sanken Electric USA Inc.

Digilent, Inc.

Trinamic Motion Control GmbH

XP Power

Laird Thermal Systems, Inc.

Samsung Semiconductor, Inc.

Adafruit Industries LLC

Seeed Technology Co., Ltd

Rochester Electronics, LLC

Powertip Technology Inc.

Mornsun America, LLC

Nippon Pulse America, Inc.

Amphenol Tuchel Industrial

Harris Corporation

Fairchild Semiconductor

International Rectifier

Sanyo

Featured Products

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Part Number	Manufacturer	Description	In stock	Quantity	Package	Status	Detail
FSB50760SF	Fairchild Semiconductor	AC MOTOR CONTROLLER, 9.4A	4625	RFQ	Bulk	Active	Detail
IM241S6S1BAUMA1	Infineon Technologies	CIPOS MICRO PG-DIP-23	9954	RFQ	Tape & Reel (TR)	Active	Detail
IM241M6S1BAUMA1	Infineon Technologies	CIPOS MICRO PG-SOP-23	9082	RFQ	Tape & Reel (TR)	Active	Detail
IM241M6S1JAUMA1	Infineon Technologies	CIPOS MICRO PG-DIP-23	6984	RFQ	Tape & Reel (TR)	Active	Detail
FPDB50PH60	onsemi	AC MOTOR CONTROLLER, HYBRID	6832	RFQ	Bulk	Active	Detail
FSAM50SM60G	onsemi	MOTION-SPMTM (SMART POWER MODULE	8076	RFQ	Bulk	Active	Detail
FNB35060T	onsemi	PWR DRVR MOD 600V 50A 27PWRDIP	3199	RFQ	Tube	Active	Detail
FNA41560B2	onsemi	MODULE SPM 600V 15A 26PWRDIP	2931	RFQ	Tube	Active	Detail
2ED300C17SROHSBPSA1	Infineon Technologies	IGBT MODULE 1700V 30A	1577	RFQ	Tray	Active	Detail
108161050002	Laird Thermal Systems, Inc.	PC5,161,F1,4040,TA,RT,W6	5866	RFQ	Box	Active	Detail
QHL75300S05	XP Power	DC-DC 75W BASEPLATE COOLED	2998	RFQ	Box	Active	Detail
QHL75300S48	XP Power	DC-DC 75W BASEPLATE COOLED	3762	RFQ	Box	Active	Detail

14 / 158 page，total 1889 results

Power Driver Modules

Power driver modules provide the physical containment for power components, usually IGBTs and MOSFETs in a half bridge or one-, two- or three-phase configurations. Power semiconductors or dies are soldered or sintered on a substrate that carries the power semiconductors and provides electrical and thermal contact and electrical insulation where needed. Power modules provide a higher power density and are in many cases more reliable and easier to cool.